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99.9% 3-5μm Metallurgy and Lubrication addition of High purity metal Tin powder

Short Description:

  • CAS No.: 7440-31-5
  • Molecular Formula: Sn
  • Quality Standard: 99.9%
  • Packing: III
  • Minimum Order: Depends on your requirement
  • Density: 7.3
  • Boiling Point: 2270 °C(lit.)
  • Melting Point: 231.9 °C(lit.)
  • Molecular Weight: 118.70100
  • Flash Point: 2270°C
  • WGK Germany: 1
  • RTECS: XP7320000
  • Hazard Class: 4.1
  • HS Code: 7106929000
  • EINECS: 231-141-8

Product Detail

Product Tags

纳米锡1
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113

Basic information:

Nanometer tin powder prepared by evaporation and condensation method, high sphericity, high purity, small particle size, uniform distribution, large specific surface area, small loose density, good dispersion, high oxidation temperature, good sintering shrinkage, is widely used in metal superhard materials as a fine grain, dispersion strengthening effect, improve the wear resistance and toughness of materials.

Model APS(nm) Purity(%) SSA(m2/g) Volumn Density (g/cm3) Density(g/cm3) Crystal Form Color
ZY-Sn001 50 >99.9 27.5 0.4 5.7 spherical grey
ZY-Sn002 500 >99.9 15 1.2 5.7 spherical grey
ZY-Sn003 1000 >99.9 8 1.5 5.7 subspherical grey

Application:

1. Micro and nano tin powder as a metal nano-lubricating additive: Add 0.1~0.5% nanometer tin powder to lubricating oil and grease to form self-lubricating and self-healing film on the surface of friction pair during friction process, which significantly reduces the anti-wear and anti-friction performance of friction pair;

2. Micro-nano tin powder as an active sintering additive: micro-nano tin powder greatly reduces the sintering temperature of non-metallurgical powder products and high temperature ceramic products in non-metallurgical powder;

3. Micro and nano tin solder: instead of micron tin powder to prepare high-performance welding and packaging alloy materials, used to improve welding performance and reduce welding temperature;

4. Metal and non-metal surface conductive coating treatment: in the absence of oxygen, the temperature below the melting point of the powder coating, this technology can be used for the production of microelectronic devices.

 Storage Condition

This product is packed with inert plastic bags, sealed and stored in dry and cool environment, should not be exposed to air, prevent moisture oxidation and agglomeration, affect the dispersion performance and use effect; The quantity of packaging can be provided according to customer's request, sub-packaging.

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Certificate

The products have been approved by FDA,REACH,ROSH,ISO and other certification, in line with national standards.

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Advantage
Quality First
Competitive Price
First-class Production Line
Factory Origin
Customized Services

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Factory

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Packing

1kg/ bag; 25kg/ barrel;
20 tons/1×20‘FCL Shipment.

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FAQ:
Q: Are you trading company or manufacturer ?
A: We are factory.

Q: How long is your delivery time?
A: Generally it is 5-10 days if the goods are in stock. or it is 15-20 days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra ?
A: Yes, we could offer the sample for free charge but do not pay the cost of freight.

Q: What is your terms of payment ?
A: Payment<=1000USD, 100% in advance. Payment>=1000USD, 30% T/T in advance ,balance before shippment.


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